| | Circoflex Corporation specializes in the timely design, development
and production of printed circuit boards. Our innovative approach and well diversified expertise on CircoFlex engineering team is assisting our customers in cost effective design and implementation of features in their electronic packaging. Our support includes outside field application engineers and quarterly publications to introduce any advance development in the electronic industries. ASSEMBLY CAPABILITIES:Our partnership with a local assembly operation has enabled us to offer value added SMT capabilities to our Printed Circuit Board customers. SURFACE FINISHING:HASL,Ni / Au,Immersion Gold, Silver & Tin,OSP & Carbon Ink,Wire Bondable Soft Gold. CAPABILITIES AND TECHNOLOGIES:Fine Pitch and Fine Line Pattern Capability;Buried and Blind via High Layer Count, Up To 24 Layers;Thin Core Layer Multilayer (Less than 3 mil core); & Controlled Impedance. We have implemented IT and JIT system throughout our manufacturing processes to support "Time-To-Market" urgency. MATERIALS:FR-4;Polymide;Teflon and Arlon;Hi Speed – RF. EVIRONMENTAL AWARENESS:CircoFlex has been rewarded for its environmental initiatives in protecting our environment. All our team members are trained and engaged with waste water and solid waste minimization program throughout the manufacturing processes and working towards ISO-14000.TURNAROUND: 3 DAYS ON PROTOTYPES AND 2 WEEKS ON PRODUCTION.
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