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About Qual Tech Circuits , Inc: |
PCB MANUFACTURING CAPABILITIES MATRIX Material: FR-4 (UL Approved) FR-5 CEM Series Polyimide Teflon/Duroid Metal Core and Thermal Clad Getek , Kevlar, Aramid Roger’s Ask about Special Combination Soldermask Used: Liquid Photo Imageable Thermal Cure -SR1000, SR1010, SR1020 Dry Film Different colors available Finish: SMOBC Hot Air Solder Level Lead Free HASL Nickel/Gold, Full Selective Carbon Ink Immersion Tin Lead free solder Layers: Unclad, Single Sided Double Sided Multi-Layerd up to 12 Layers Design Media: Customer Supplied Artwork File Transfer via Modem Email Attachment Specifications: UL Approved, 94V-0 Standard Commercial IPC-A-600 Special Specification Requests Special Technologies: Electroless Silver and Gold 5 Mil Line / 5 Mil Space 12 Mil Pitch Thin Multilayered up to 0.015" Small Holes to 0.010" Surface Mount and Through Hole BGA, PCMCIA Bright Tin/Lead Process Blind/Buried vias Controlled Impedance/Dielectric Heat Sinks Carbon Ink, Epoxy Filled Quick Turn Around: 8 Hour (Single/Double) 48 Hour (Multilayered) Facility: 10,000 sq. feet located in Addison, IL near O’Hare International Airport. |